Thermoconductive Paste GC- 5 for Dissipators 3,5 g - Gelid Solutions ICPU-GE-GC 5 A

The superior thermal conductivity à of GC- 5 contributes to improving the overall thermal management of electronic devices. Its use è diffused in CPU, GPU, UPS systems and various other temperature sensitive components.  It is specifically designed to improve performance, reliabilityà and assembly efficiency of advanced integrated circuits (IC). ICPU-GE-GC 5 A comes with synthetic particle-enhancing micron filler and polymer matrix to ensure maximum conductivityà, perfect space filling and optimal viscosità. Not electrically conductive, it includes an additional applicator for super easy use.

Features

• Maximum thermal conductivity
• Electrically non-conductive composite
• Non-corrosive, non-hardening and non-toxic
  
• Ultra resistant
• Easy to use
• Don't drool
  
• 
  Precise and safe
  
• GELID applicator
  
• Operating temperature range from - 40 ° to + 150 °C
  

Technical specifications

• Densità (g/cm 3): 2,8
  
• Viscosity @ 23°C: 3.3 x 10⁵
• Offers exceptionally low thermal resistance: 0,053 °C-cm²/W
• Reaches ultra-thin gluing line thickness (BLT) of about 20 µm
  
• Syringe contents: 3,5 g
• Color: gray

Package contents

• Thermoconductive paste ICPU-GE-GC 5 A
  
• Gelid applicator
  
• User manual